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 产品介绍
 Circuit board Equipment >> Pre-treatment before hot air leveling >> Pre-treatment before hot air leveling

Pre-treatment before hot air leveling
Characteristics:
It is used for pre-treatment before hot air leveling, which can keep the surface of the copper foil and the holes wall clean, activation and coarsening. So it ensures the eveness and leveling of the PCB tin solder.
Process Flow
Put the plate—etching—recycle water washing—hi-pressure water washing—clean water washing—dry the plate—check—apply flux
Main Parameter:
1
Work table width 640mm
2
Work Height 900±25mm
3
Convey Speed 0-5m/min
4
Application Max:600mm*any dimension Min: 80mm*120mm
5
Thickness 0.4-2.5mm

Our company products a series of etching,cleaning electroplating equipment.At present,we have cooperated with iphone,asus,HP,HTC,Samsung,LG and other industry brand processing manufactures,and we have achieved good reputation.Warmly welcome friends at home and abroad to visit our company and negotiate business.

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